New hardware revision introduces stability features from the PS5 Pro
Summary
– Sony updates the PS5 Slim with a grooved heatsink borrowed from the PS5 Pro
– New design improves liquid metal control and long-term thermal reliability
– Hardware change arrives quietly with the CFI-2116 model revision
Sony has introduced a significant hardware refinement to the PlayStation 5 Slim without any formal announcement. The latest CFI-2116 revision replaces the older flat-style heatsink with a grooved version similar to the one found in the PlayStation 5 Pro. The updated structure features precision-machined channels around the APU contact plate.
Repair specialists note that the change addresses a well-documented issue involving the console’s liquid metal thermal compound. Earlier models sometimes developed dry spots or leaks as the liquid metal shifted away from the processor over time. The new grooves help hold the material in place through capillary action, ensuring even coverage and improving stability.
According to modders who examined the revised unit, the updated Slim now operates with more consistent thermals and is considered the most stable PS5 variant available at retail. The discovery surfaced only through teardown footage since Sony did not publicly acknowledge the upgrade.
With the current PlayStation generation expected to continue until at least 2027, the revision signals Sony’s ongoing focus on durability for a system approaching its sixth year on the market.
MASSIVE PS5 NEWS! SONY’S SILENT HARDWARE UPGRADE!
The MOST important hardware update of the year is here!
Sony has quietly updated all new PlayStation 5 Slim consoles (model CFI-2116) — both Disc and Digital Editions — with an ALL-NEW cooling system! 🔥
This isn't just a fix;… pic.twitter.com/yvrYUvaGL7— modyfikatorcasper (@Modyfikator89) November 30, 2025
